The progress of epoxy resin AB glue for LED packaging

October 22, 2024

The development history of epoxy resin AB glue for LED packaging ranges from the application of the initial liquid bisphenol A epoxy resin to the application of alicyclic epoxy resin and, most recently, silicone - hybrid alicyclic epoxy resin. It focuses on sharing the formulations, properties, and domestic and international research progress of epoxy resin glue for through - hole LED and Nixie tube packaging, epoxy resin AB glue for SMD RGB packaging, and epoxy resin AB glue for Mini LED packaging (such as epoxy resin AB glue cured by composite amines, epoxy resin AB glue for matte display packaging, epoxy resin AB glue cured by thermal cations, and silicone - hybrid alicyclic epoxy resin AB glue cured by anhydrides, etc.), and looks forward to the development requirements and trends of new - type epoxy resins in the future.

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